CC2564C Datasheet, PDF (43/52 Pages) Texas Instruments – CC2564C Dual-Mode Bluetooth Controller

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Table 7-1 lists the BOM for the VQFN-MR package.
CC2564C
SWRS199A – APRIL 2016 – REVISED NOVEMBER 2016
Table 7-1. Bill of Materials
QTY
1
REF.
DES.
ANT1
6 Capacitor
2 Capacitor
2 Capacitor
2 Capacitor
1
FL1
1
OSC1
1
U5
1
Y1
1
C31
VALUE
NA
0.1 µF
1.0 µF
12 pF
0.47 µF
2.45 GHz
32.768 kHz 15 pF
CC2564CRVM
26 MHz
22 pF
DESCRIPTION
ANT_IIFA_CC2420_32mil_MIR
Capacitor, ceramic; 0.1-µF
6.3-V 10% X7R 0402
Capacitor, ceramic; 1.0-µF
6.3-V 10% X5R 0402
Capacitor, ceramic; 12 pF
6.3-V X5R 10% 0402
Capacitor, ceramic; 0.47-µF
6.3-V X5R ±10% 0402
Filter, ceramic bandpass,
2.45-GHz SMD
Oscillator; 32.768-kHz 15-pF
1.5-V 3.3-V SMD
CC2564C dual-mode Bluetooth
controller
Crystal, 26 MHz
Capacitor, ceramic; 22-pF
25-V 5% NP0 0201
MANUFACTURER
NA
Kemet
Taiyo Yuden
Murata Electronics
Taiyo Yuden
Murata Electronics
Abracon
Corporation
Texas Instruments
NDK
Murata Electronics
North America
MANUFACTURER
PART NUMBER
IIFA_CC2420
C0402C104K9RACTU
JMK105BJ105KV-F
GRM1555C1H120JZ01D
JMK105BJ474KV-F
LFB212G45SG8C341
ASH7K-32.768KHZ-T
CC2564CRVM
NX2016SA
GRM0335C1E220JD01D
(EXS00A-CS06025)
ALT
PART
Chip
antenna
DEA162450
BT_1260B3
(TDK)
TZ1325D
(Tai-Saw
TST)
NOTES
Copper antenna
on PCB
Place brown
marking up
Optional
7.2 PCB Layout Guidelines
This section describes the PCB guidelines to speed up the PCB design using the CC256x QFN device.
Following these guidelines ensures that the design will pass Bluetooth SIG certification and also minimizes
risk for regulatory certifications including FCC, ETSI, and CE. For more information, see CC256x QFN
PCB Guidelines.
7.2.1 General PCB Guidelines
General PCB guidelines follow:
• You must verify the recommended PCB stackup in the PCB Design guidelines.
• You must verify the dimensions of the QFN PCB footprint in the QFN Package Information section of
CC256x QFN PCB Guidelines and in Section 6.
• The decoupling capacitors must be as close as possible to the QFN device.
Copyright © 2016, Texas Instruments Incorporated
Applications, Implementation, and Layout
43
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