CC2564C Datasheet, PDF (3/52 Pages) Texas Instruments – CC2564C Dual-Mode Bluetooth Controller

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CC2564C
SWRS199A – APRIL 2016 – REVISED NOVEMBER 2016
Table of Contents
1 Device Overview ......................................... 1
1.1 Features .............................................. 1
1.2 Applications........................................... 1
1.3 Description............................................ 2
1.4 Functional Block Diagram ............................ 2
2 Revision History ......................................... 3
3 Device Comparison ..................................... 4
3.1 Related Products ..................................... 4
4 Terminal Configuration and Functions ............. 5
4.1 VQFN-MR Pin Diagram............................... 5
5 Specifications ............................................ 8
5.1 Absolute Maximum Ratings .......................... 8
5.2 ESD Ratings.......................................... 8
5.3 Power-On Hours...................................... 8
5.4 Recommended Operating Conditions ................ 9
5.5 Power Consumption Summary ....................... 9
5.6 Electrical Characteristics ............................ 11
5.7 Thermal Resistance Characteristics for VQFN-MR
(RVM) Package .................................... 11
5.8 Timing and Switching Characteristics ............... 12
6 Detailed Description ................................... 23
6.1 Overview ............................................ 23
6.2 Functional Block Diagram........................... 23
6.3 Clock Inputs ......................................... 23
6.4 Functional Blocks.................................... 27
6.5 Bluetooth^® BR and EDR Features .................. 38
6.6 Bluetooth^® low energy Description.................. 39
6.7 Bluetooth^® Transport Layers ........................ 40
6.8 Changes from the CC2564B Device to the
CC2564C Device.................................... 40
7 Applications, Implementation, and Layout........ 41
7.1 Reference Design Schematics and BOM for Power
and Radio Connections ............................. 41
7.2 PCB Layout Guidelines ............................. 43
8 Device and Documentation Support ............... 47
8.1 Third-Party Products Disclaimer .................... 47
8.2 Tools and Software ................................. 47
8.3 Device Nomenclature ............................... 47
8.4 Documentation Support ............................. 48
8.5 Community Resources .............................. 48
8.6 Trademarks.......................................... 48
8.7 Electrostatic Discharge Caution..................... 48
8.8 Glossary ............................................. 48
9 Mechanical, Packaging, and Orderable
Information .............................................. 49
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from April 8, 2016 to October 27, 2016
Page
• Updated document to PRODUCTION DATA ..................................................................................... 1
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Revision History
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