CC2564C Datasheet, PDF (47/52 Pages) Texas Instruments – CC2564C Dual-Mode Bluetooth Controller

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CC2564C
SWRS199A – APRIL 2016 – REVISED NOVEMBER 2016
8 Device and Documentation Support
8.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES
NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR
SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR
SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
8.2 Tools and Software
Design Kits and Evaluation Modules
CC256x Bluetooth^® Hardware Evaluation Tool This intuitive, user-friendly TI tool is used to evaluate
TI's Bluetooth chips and can be downloaded as a complete package from the TI web site.
More specifically, the tool is used to configure the properties of the Bluetooth chip through
the Service Pack (SP) and also allows testing of RF performance.
For a complete listing of development-support tools, see the TI CC256x wiki. For information on pricing
and availability, contact the nearest TI field sales office or authorized distributor.
8.3 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers. These
prefixes represent evolutionary stages of product development from engineering prototypes through fully
qualified production devices.
Device development evolutionary flow:
X
Experimental device that is not necessarily representative of the final device's electrical
specifications and may not use production assembly flow.
P
Prototype device that is not necessarily the final silicon die and may not necessarily meet
final electrical specifications.
null
Production version of the silicon die that is fully qualified.
CC2564C xxx x
Prefix
X = Experimental device
Blank = Qualified device
R = Large Reel
T = Small Reel
Generic Part Number
Package Designator
RVM = VQFNP-MR
YFV = DSBGA
Copyright © 2016, Texas Instruments Incorporated
Figure 8-1. CC2564C Device Nomenclature
CC2564C
YM7
ZLLL G3
Y = Last digit of the year
M = Month in hex number, 1-C for Jan-Dec
7 = Primary site code for ANM
Z = Secondary site code for ANM
LLL = Assembly lot code
= Pin 1 indicator
Figure 8-2. Chip Markings (VQFN-MR Package)
Copyright © 2016, Texas Instruments Incorporated
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