CC2564C Datasheet, PDF (11/52 Pages) Texas Instruments – CC2564C Dual-Mode Bluetooth Controller

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CC2564C
SWRS199A – APRIL 2016 – REVISED NOVEMBER 2016
5.6 Electrical Characteristics
RATING
High-level output voltage, V_OH
Low-level output voltage, V_OL
I/O input impedance
Output rise and fall times, 10% to 90% (digital pins)
PU
PCM–I2S bus, TX_DBG
I/O pull
PD
currents
PU
All others
PD
CONDITION
At 2, 4, 8 mA
At 0.1 mA
At 2, 4, 8 mA
At 0.1 mA
Resistance
Capacitance
C_L = 20 pF
Typical = 6.5
Typical = 27
Typical = 100
Typical = 100
MIN
0.8 × VDD_IO
VDD_IO – 0.2
0
0
1
3.5
9.5
50
50
MAX
VDD_IO
VDD_IO
0.2 × VDD_IO
0.2
5
10
9.7
55
300
360
UNIT
V
V
MΩ
pF
ns
µA
5.7 Thermal Resistance Characteristics for VQFN-MR (RVM) Package
over operating free-air temperature range (unless otherwise noted)
THERMAL METRICS⁽¹⁾
C/W ⁽²⁾
Rθ_ja
Rθ_jctop
Rθ_jcbottom
Rθ_jb
φ_jt
φ_jb
Junction-to-free-air
Junction-to-case-top
Junction-to-case-bottom
Junction-to-board
Junction-to-package-top
Junction-to-package-bottom
34.6
17.9
1.6
12.0
0.2
12.0
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
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Specifications
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