OMAP4430 Datasheet, PDF (408/443 Pages) Texas Instruments – Multimedia Device

OMAP4430
Public Version
SWPS041D – DECEMBER 2010 – REVISED JANUARY 2012
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For the conductor layers, the correct conductivity needs to be programmed into the simulation tool. This is
followed by pin-grouping of the power and ground nets, and applying appropriate voltage/current sources.
The current and voltage information can be obtained from the power and voltage specifications of the
device under different operating conditions / use-modes. After running the simulation, the lumped
resistance and lumped IR drop can be examined as shown in Figure A-15.
A.2.4 System ESD Generic Guidelines
NOTE
IEC61000-4-2: The ESD discharges described in this section apply only to HDMI, USBA0
PHY, SD/MMC card cage, composite video, JTAG, cJTAG, and points and surfaces of the
Equipment Under Test (EUT) that are accessible to the end-user during normal use.
The following exclusions apply (that is, discharges are not applied to these items):
• In the case of the contacts of coaxial and multipin connectors which are provided with a metallic
connector shell, contact discharges are only applied to the metallic shell contacts. Falling into this
category:
HDMI/USB connectors, SD/MMC card cage, audio headset jack connector
• Those points and surfaces which are only accessible under service by the end-user. Examples of
these rarely accessed points are battery contacts while changing batteries. Falling into this category:
Battery connector
• Those points and surfaces which are only accessible under maintenance. In this case, special ESD
mitigation procedures are given in the accompanying documentation. Falling into this category:
JTAG test points
• Those points and surfaces of equipment which are no longer accessible after fixed installation or after
following the instructions for use, for example, the bottom and/or wall side of equipment or areas
behind fitted connectors. Potentially falling into this category:
Audio speaker spring contacts
A.2.4.1 IEC61000-4-2 Standard Overview—System ESD
System ESD differs from the usual component level ESD tests such as HBM (ANSI/ESDA/JEDEC
JS-001-2010) or CDM (JESD22 C101) described in Table 3-1, Absolute Maximum Ratings. HBM and
CDM are tests to evaluate product robustness to ESD events in the manufacturing environment. System
ESD is designed to evaluate events that occur when the end-users interact with the final product as they
use it. IEC 61000-4-2 is one of the major system level standards used to qualify products for human
contact. Sometimes these events are referred to as EMC immunity events.
The standard defines immunity requirements for ESD which can be coupled into the equipment directly
(contact discharge) or indirectly through radiation .The charging model is defined with a discharging
150-pF capacitor through a 330-Ω resistor. Direct coupling includes any user accessible entry points such
as external connectors, keypad, panel displays, equipment housings, etc.
The ESD stress level is divided into four levels. Level 1 is considered the least severe while Level 4 is the
most severe. IEC 61000-4-2 also specifies the ESD current waveform and parameters shown in
Figure A-16 and Table A-3. The rise time is extremely fast, defined as 0.7 to 1 ns to reach the first peak,
with a second peak at 30 ns and a total duration of only 60 ns.
408 OMAP4430 Processor Multimedia Device PCB Guideline
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