DRV2510-Q1 Datasheet, PDF (4/32 Pages) Texas Instruments – DRV2510-Q1 3-A Automotive Haptic Driver for Solenoids and Voice Coils with Integrated Diagnostics

DRV2510-Q1
SLOS919A – JUNE 2016 – REVISED JUNE 2016
6 Specifications
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6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
VDD DC supply voltage range
Supply voltage
VDD pulsed supply voltage range. t < 400 ms exposure
VDD supply voltage ramp rate
Input voltage, V_I
SCL, SDA, EN
IN+, IN-, STDBY
DC current on VDD, GND, OUT+, OUT-
Current
Maximum current in all input pins
Maximum sink current for open-drain pins
Operating free-air temperature, T_A
Storage temperature range, T_stg
MIN
MAX
UNIT
–0.3
30
V
–1
40
15
V/ms
–0.3
5
V
–0.3
6.5
–4
4
A
–1
1
mA
7
–40
125
°C
–55
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins⁽²⁾
VALUE
±3500
±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
VDD
V_IH
V_IL
V_OL
V_OH
I_IH
R_L
C_B
Supply voltage. VDD.
High-level input voltage. SDA, SCL, STDBY, EN.
Low-level input voltage. SDA, SCL, STDBY, EN
Low-level output voltage
High-level output voltage
High-level input current. SDA, SCL, STDBY, EN
Minimum load Impedance
Load capacitance for each bus line (SDA/SCL)
MIN
NOM
MAX UNIT
5
18
V
2.1
V
0.7
V
0.4
V
2.4
V
50
µA
1.5
Ω
400
pF
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
DRV2510-Q1
PWP (HTSSOP)
UNIT
{16} PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
39.4
°C/W
24.9
°C/W
20
°C/W
0.6
°C/W
19.8
°C/W
2
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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