DDC264 Datasheet, PDF (4/26 Pages) Texas Instruments – 64-Channel, Current-Input Analog-to-Digital Converter

DDC264
SBAS368C – MAY 2006 – REVISED JULY 2011
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
At T_A = +25°C, AVDD = +5V, DVDD = +3.0V, VREF = +4.096V, t_INT = 333μs for DDC264C or 166μs for DDC264CK,
and Range = 3 (150pC), unless otherwise noted.
DDC264C
DDC264CK
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
MIN
TYP
MAX
UNIT
PERFORMANCE OVER TEMPERATURE
Offset Drift
Offset Drift Stability
DC Bias Voltage Drift⁽⁸⁾
Input Bias Current Drift
Range Drift⁽⁹⁾
Range Drift Match⁽¹⁰⁾
T_A = +25°C to +45°C
±0.5
5 ⁽⁷⁾
±0.2
2 ⁽⁷⁾
±3
0.01
1 ⁽⁷⁾
25
50
±5
±0.5
±0.2
±3
0.01
25
±5
5 ⁽⁷⁾
ppm of FSR/°C
2 ⁽⁷⁾
ppm of FSR/minute
μV/°C
1 ⁽⁷⁾
pA/°C
50
ppm/°C
ppm/°C
REFERENCE
Voltage
Input Current⁽¹¹⁾
DIGITAL INPUT/OUTPUT
4.000
4.096
4.200
4.000
4.096
4.200
V
Average Value with t_INT = 333μs
825
Average Value with t_INT = 166μs
μA
1650
μA
Logic Levels
V_IH
V_IL
V_OH
V_OL
Input Current (I_IN)
Data Format⁽¹²⁾
I_OH = –500μA
I_OL = 500μA
0 < V_IN < DVDD
0.8 DVDD
DVDD + 0.1 0.8 DVDD
DVDD + 0.1
V
–0.1
0.2 DVDD
–0.1
0.2 DVDD
V
DVDD – 0.4
DVDD – 0.4
V
0.4
0.4
V
±10
±10
μA
Straight Binary
Straight Binary
POWER-SUPPLY REQUIREMENTS
Analog Power-Supply Voltage (AVDD)
4.75
5.0
5.25
4.9
5.0
5.1
V
Digital Power-Supply Voltage (DVDD)
2.7
3.3
3.6
2.7
3.3
3.6
V
Supply Current
Analog Current
34
60
mA
Digital Current
7.5
15
mA
Total Power Dissipation
192
256
350
mW
Per Channel Power Dissipation
3
4
5.5
mW/Channel
(7) Ensured by design; not production tested.
(8) Voltage produced by the DDC264 at its input that is applied to the sensor.
(9) Range drift does not include external reference drift.
(10) Matching between side A and side B of the same input.
(11) Input reference current decreases with increasing t_INT (see the Voltage Reference section).
(12) Data format is Straight Binary with a small offset. The number of bits in the output word is controlled by the Format bit.
THERMAL INFORMATION
THERMAL METRIC⁽¹⁾
DDC264C,
DDC264CK
ZAW Package
UNITS
100 Balls
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
25.7
9.8
7.1
°C/W
0.1
7.0
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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