DAC8550_16 Datasheet, PDF (4/31 Pages) Texas Instruments – 16-bit, Ultra-Low Glitch, Voltage Output Digital-To-Analog Converter

DAC8550
SLAS476F – MARCH 2006 – REVISED MARCH 2016
6 Specifications
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6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Supply voltage
Digital input voltage range
Output voltage
Junction temperature, T_J(max)
Operating temperature, T_A
Storage temperature, T_stg
GND
GND
GND
MIN
MAX
–0.3
6
–0.3 V_DD + 0.3
–0.3 V_DD + 0.3
150
–40
105
–65
150
UNIT
V
V
V
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
±2000
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
POWER SUPPLY
V_DD
Supply voltage
DIGITAL INPUTS
D_IN
Digital input voltage
REFERENCE INPUT
V_REF
Reference input voltage
AMPLIFIER FEEDBACK INPUT
V_FB
Output amplifier feedback input
TEMPERATURE RANGE
T_A
Operating ambient temperature
SCLK and SYNC
MIN
NOM
MAX UNIT
2.7
5.5
V
0
V_DD
V
0
V_DD
V
V_O
V
–40
105 °C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
DAC8550
DGK (VSSOP)
UNIT
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
206
°C/W
44
°C/W
94.2
°C/W
10.2
°C/W
92.7
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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