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MSP432P401R_16 Datasheet, PDF (39/200 Pages) Texas Instruments – Mixed-Signal Microcontrollers
www.ti.com
MSP432P401R, MSP432P401M
SLAS826E – MARCH 2015 – REVISED JULY 2016
5.21 Current Consumption in LPM3, LPM4 Modes
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (2) (3) (4) (5) (6)
PARAMETER
–40°C
25°C
60°C
85°C
VCC
TYP MAX
TYP MAX
TYP MAX
UNIT
TYP MAX
ILPM3_VCORE0_RTCLF (7) (8)
2.2 V
0.52
3.0 V
0.54
0.64
1.11
0.66
0.85
1.13
2.43
μA
2.46
5
ILPM3_VCORE0_RTCREFO (9) (8)
2.2 V
3.0 V
0.85
0.95
1.07
1.55
1.16
1.35
1.64
2.89
μA
2.98
5.6
ILPM3_VCORE1_RTCLF (7) (8)
2.2 V
0.72
3.0 V
0.75
0.93
1.47
0.95
1.35
1.5
2.95
μA
2.98
6
ILPM3_VCORE1_RTCREFO (9) (8)
2.2 V
3.0 V
1.04
1.14
1.3
1.87
1.4
1.7
1.96
3.34
μA
3.44
6.5
ILPM4_VCORE0 (10)
2.2 V
0.37
3.0 V
0.4
0.48
0.92
0.5
0.65
0.94
2.19
μA
2.2
4.8
ILPM4_VCORE1 (10)
2.2 V
0.54
3.0 V
0.56
0.7
1.2
0.72
0.98
1.23
2.58
μA
2.6
5.6
(1) Current measured into VCC.
(2) All other input pins tied to 0 V or VCC. Outputs do not source or sync any current.
(3) CPU is off, and flash is powered down.
(4) Bank 0 of SRAM retained, all other banks are powered down.
(5) See Table 5-47 for details on additional current consumed for each extra Bank that is enabled for retention.
(6) SVSMH is disabled.
(7) RTC sourced by LFXT. Effective load capacitance of LF crystal is 3.7 pF.
(8) WDT module is disabled.
(9) RTC sourced by REFO.
(10) RTC and WDT modules disabled.
5.22 Current Consumption in LPM3.5, LPM4.5 Modes
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1) (2)
PARAMETER
–40°C
25°C
60°C
85°C
VCC
TYP MAX
TYP MAX
TYP MAX
TYP MAX
ILPM3.5_RTCLF (3) (4) (5) (6) (7)
2.2 V
3.0 V
0.48
0.5
0.6
1.07
0.63
0.81
1.1
2.36
2.38
4.9
ILPM3.5_RTCREFO (3) (4) (8) (6) (7)
2.2 V
3.0 V
0.82
0.92
1.03
1.52
1.12
1.3
1.61
2.81
2.9
5.5
ILPM4.5 (9) (7)
2.2 V
10
3.0 V
15
20
45
25
35
50
125
150
300
(1) Current measured into VCC.
(2) All other input pins tied to 0 V or VCC. Outputs do not source or sync any current.
(3) CPU and flash are powered down.
(4) Bank 0 of SRAM retained, all other banks powered down.
(5) RTC sourced by LFXT. Effective load capacitance of LF crystal is 3.7 pF.
(6) WDT module is disabled.
(7) SVSMH is disabled.
(8) RTC sourced by REFO.
(9) No core voltage. CPU, flash, and all banks of SRAM are powered down.
UNIT
μA
μA
nA
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Specifications
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