DS90UA102-Q1_14 Datasheet, PDF (39/47 Pages) Texas Instruments – Multi-Channel Digital Audio Link

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DS90UA102-Q1
SNLS442A – JULY 2013 – REVISED SEPTEMBER 2013
DS90UA102-Q1
1.8V
VDDIO
VDDD
C3
C11
VDDIO
C8 C16
C18
VDDR
C4
C12
VDDIO
C9
1.8V
FB1
1.8V
FB2
VDDR
C5
C13
C6 C14
VDDPLL
C17
C7 C15
VDDCML
C19
Serial
Interface
C1
503 ^C2
GPIO
Interface
VDDCML
RIN+
RIN-
GPIO0
GPIO1
GPIO2
GPIO3
I²C
Bus
Interface
VDDIO
PDB
OEN
OSS_SEL
BISTEN
RPU
RPU
SCL
SDA
RES0
DAP (GND)
VDDIO
C10
SCK
LRCK
BCK
DOUT0
DOUT1
DOUT2
DOUT3
DOUT4
DOUT5
DOUT6
DOUT7
Digital
Audio
Interface
GPO0
GPO1
GPO2
GPO3
LOCK
PASS
GPO
Interface
1.8V
10 k3
IDx
RID
NOTE:
C1 = 0.1 µF (50 WV)
C2 = 0.047 µF (50 WV)
C3 - C10 = 0.01 µF
C11 - C16 = 0.1 µF
C17 - C18 = 4.7 µF
C19 = 22 µF
RPU = 4.7 k3
RID (see IDx Resistor Value Table)
FB1, FB2: Impedance = 1 k3 (@ 100 MHz)
low DC resistance (<13)
All RES0 pins should be tied to GND
All RES1 pins should be left floating
Figure 32. Typical Connection Diagram (Coax Cable)
PCB Layout and Power System Considerations
Circuit board layout and stack-up for the Ser/Des devices should be designed to provide low-noise power feed to
the device. Good layout practice will also separate high frequency or high-level inputs and outputs to minimize
unwanted stray noise pickup, feedback and interference. Power system performance may be greatly improved by
using thin dielectrics (2 to 4 mils) for power / ground sandwiches. This arrangement provides plane capacitance
for the PCB power system with low-inductance parasitics, which has proven especially effective at high
frequencies, and makes the value and placement of external bypass capacitors less critical. External bypass
capacitors should include both RF ceramic and tantalum electrolytic types. RF capacitors may use values in the
range of 0.01 µF to 0.1 µF. Tantalum capacitors may be in the 2.2 µF to 10 µF range. Voltage rating of the
tantalum capacitors should be at least 5X the power supply voltage being used.
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