THS1041_15 Datasheet, PDF (35/42 Pages) Texas Instruments – 10-Bit, 40-MSPS ANALOG-TO-DIGITAL CONVERTER WITH PGA AND CLAMP

PACKAGE OPTION ADDENDUM
www.ti.com
5-Oct-2015
PACKAGING INFORMATION
Orderable Device
THS1041CDW
THS1041CPW
THS1041CPWG4
THS1041CPWR
THS1041CPWRG4
THS1041IDW
THS1041IPW
THS1041IPWG4
Status Package Type Package Pins Package Eco Plan
(1)
Drawing
Qty
(2)
OBSOLETE SOIC
DW 28
TBD
ACTIVE TSSOP
PW
28
50 Green (RoHS
& no Sb/Br)
ACTIVE TSSOP
PW
28
50 Green (RoHS
& no Sb/Br)
ACTIVE TSSOP
PW 28 2000 Green (RoHS
& no Sb/Br)
ACTIVE TSSOP
PW 28 2000 Green (RoHS
& no Sb/Br)
OBSOLETE SOIC
DW 28
TBD
OBSOLETE TSSOP
PW 28
TBD
OBSOLETE TSSOP
PW 28
TBD
Lead/Ball Finish
(6)
Call TI
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
Call TI
Call TI
MSL Peak Temp Op Temp (°C)
(3)
Call TI
0 to 70
Level-1-260C-UNLIM
0 to 70
Level-1-260C-UNLIM
0 to 70
Level-1-260C-UNLIM
0 to 70
Level-1-260C-UNLIM
0 to 70
Call TI
Call TI
Call TI
-40 to 85
-40 to 85
-40 to 85
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Device Marking
(4/5)
TH1041
TH1041
TH1041
TH1041
TH1041
TJ1041
TJ1041
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
(4) _{There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.}
Samples
Addendum-Page 1