THS6184_16 Datasheet, PDF (27/39 Pages) Texas Instruments – DUAL-PORT, LOW-POWER DIFFERENTIAL xDSL LINE DRIVER AMPLIFIERS

THS6184
www.ti.com ................................................................................................................................................. SLLS635D – AUGUST 2005 – REVISED JANUARY 2009
The actual thermal performance achieved with the THS6184 in the 24-pin RHF PowerPAD package or the 20-pin
PWP PowerPAD package depends on the application. If the size of the internal ground plane is approximately 3
inches × 3 inches, and the chip PowerPAD is soldered to the PCB thermal pad, then the expected thermal
coefficient, θ_JA, is about 32°C/W for the RHF package, and is 32.6°C/W for the PWP package. (See the Package
Dissipation Ratings Table for all other package metrics.) For a given θ_JA, the maximum power dissipation is
calculated by the following formula:
ǒ Ǔ PD +
TMAX–TA
q_JA
Where:
P_D = Maximum power dissipation of THS6184 (watts)
T_MAX = Absolute maximum operating junction temperature (130°C)
T_A = Free-ambient air temperature (°C)
θ_JA = θ_JC + θ_CA
θ_JC = Thermal coefficient from junction to case. See the Package Dissipation Ratings table.
θ_CA = Thermal coefficient from case to ambient determined by PCB layout and construction.
More complete details of the PowerPAD installation process and thermal management techniques can be found
in the Texas Instruments Technical Brief, PowerPAD Thermally Enhanced Package. This document can be found
at the TI web site (www.ti.com) by searching on the key word PowerPAD. The document can also be ordered
through your local TI sales office. Refer to literature number SLMA002 when ordering.
EVALUATION BOARD
An evaluation board is available for the THS6184. This board has been configured for proper thermal
management of the THS6184. The circuitry has been designed for a typical ADSL application as shown
previously in this document. To order the evaluation board contact your local TI sales office or distributor.
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REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (March, 2007) to Revision D ................................................................................................. Page
• Combined RHF and PWP package specifications for common-mode input range ............................................................... 4
• Combined RHF and PWP package specifications for common-mode input range ............................................................... 6
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): THS6184
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