THS6184_16 Datasheet, PDF (24/39 Pages) Texas Instruments – DUAL-PORT, LOW-POWER DIFFERENTIAL xDSL LINE DRIVER AMPLIFIERS

THS6184
SLLS635D – AUGUST 2005 – REVISED JANUARY 2009 ................................................................................................................................................. www.ti.com
ground should also be used as previously stipulated.
Because of its high power delivery, proper thermal management of the THS6184 is required. Although there are
many ways to properly heatsink this device, the following steps illustrate one recommended approach for a
multilayer PCB with an internal ground plane utilizing the 24-pin RHF, (or the 20-pin PWP) PowerPAD package.
1. Prepare the PCB with a top-side etch pattern to accommodate an RHF package as shown in Figure 58. If the
PWP package is to be used, prepare the PCB etch pattern as shown in Figure 59. There should be etch for
the leads as well as etch for the thermal pad.
2. PCB vias in the area of the thermal pad should be kept small so that solder wicking through the holes is not
a problem during reflow. All of the vias in the thermal pad should connected to the internal PCB ground
plane.
a. RHF package – Place 9 holes in the area of the thermal pad. These holes should be 0,254 mm (10 mils)
in diameter.
b. PWP package – Place 9 holes in the area of the thermal pad. These holes should be 0,33 mm (13 mils)
in diameter.
3. When connecting these holes to the ground plane, do not use the typical web or spoke via connection
methodology. Web connections have a high thermal resistance connection that is useful for slowing the heat
transfer during soldering operations. This makes the soldering of vias that have plane connections easier.
However, in this application, low thermal resistance is desired for the most efficient heat transfer. Therefore,
the holes under the THS6184 package should make their connection to the internal ground plane with a
complete connection around the entire circumference of the plated through hole.
4. The top-side solder mask should leave the terminals of the package and the thermal pad area with its
thermal transfer holes exposed. Any holes outside the thermal pad area, but still under the package, should
be covered with solder mask.
5. Apply solder paste to the exposed thermal pad area and all of the operational amplifier terminals.
6. With these preparatory steps in place, the THS6184 RHF is simply placed in position and run through the
solder reflow operation as any standard surface-mount component. This results in a part that is properly
installed.
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