THS6184_16 Datasheet, PDF (25/39 Pages) Texas Instruments – DUAL-PORT, LOW-POWER DIFFERENTIAL xDSL LINE DRIVER AMPLIFIERS

THS6184
www.ti.com ................................................................................................................................................. SLLS635D – AUGUST 2005 – REVISED JANUARY 2009
0,4953
0,1905
0,3721
Pad Size
24 x (0,3048 x 0,762) mm
0,1905
4,9022
2,2987
0,4953
3,302
5,9182
PowerPAD and Via Layout
(Pad Size 3,65 mm x 2,65 mm. 9 Vias with Diameter = 0,254 mm)
0,682
1,143
0,3641
0,563
2,65
0,762
3,65
Vias should go through the board connecting the top PowerPAD to any and all
ground planes. The larger the ground plane, the more area to distribute the heat.
Solder resist should be used on the bottom side ground plane to prevent wicking of
the solder through the vias during the process.
Note: All linear dimensions are in millimeters.
Figure 58. Suggested PCB Layout For 24-Pin RHF Package
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