THS6184_16 Datasheet, PDF (19/39 Pages) Texas Instruments – DUAL-PORT, LOW-POWER DIFFERENTIAL xDSL LINE DRIVER AMPLIFIERS

THS6184
www.ti.com ................................................................................................................................................. SLLS635D – AUGUST 2005 – REVISED JANUARY 2009
APPLICATION INFORMATION
The THS6184 contains four independent operational amplifiers. These amplifiers are current feedback topology
amplifiers made for high-speed operation. They have been specifically designed to deliver the full power
requirements of ADSL and therefore can deliver output currents of at least 400 mA at full output voltage.
The THS6184 is fabricated using Texas Instruments 36-V complementary bipolar process, BiCOM1. This
process provides exceptional device speed with high breakdown voltages.
DEVICE PROTECTION FEATURE
The THS6184 has a built-in thermal protection feature. Should the internal junction temperature rise above
approximately 160°C, the device automatically shuts down. Such a condition could exist with improper heat
sinking or if the output is shorted to ground. When the abnormal condition is fixed, the internal thermal shutdown
circuit automatically turns the device back on. This occurs at approximately 145°C, junction temperature. Note
that the THS6184 does not have short-circuit protection and care should be taken to minimize the output current
below the absolute maximum ratings.
THERMAL INFORMATION
The THS6184 is available in thermally-enhanced RHF and PWP packages, which are members of the
PowerPAD family of packages. These packages are constructed using leadframes upon which the dies are
mounted [see Figure 51 for the RHF package and Figure 52 for the PWP package]. This arrangement results in
the lead frames being exposed as thermal pads on the underside of their respective packages. Because a
thermal pad has direct thermal contact with the die, excellent thermal performance can be achieved by providing
a good thermal path away from the thermal pad. Note that the PowerPAD is electronically isolated from the
active circuitry and any pins. Thus, the PowerPAD can be connected to any potential voltage within the absolute
maximum voltage range. Ideally, connection of the PAD to the ground plane is preferred as the plane typically is
the largest copper plane on a PCB.
The PowerPAD package allows for both assembly and thermal management in one manufacturing operation.
During the surface-mount solder operation (when the leads are being soldered), the thermal pad can also be
soldered to a copper area underneath the package. Through the use of thermal paths within this copper area,
heat can be conducted away from the package into either a ground plane or other heat dissipating device. This is
discussed in more detail in the PCB design considerations section of this document.
The PowerPAD package represents a breakthrough in combining the small area and ease of assembly of
surface mount with the, heretofore, awkward mechanical methods of heatsinking.
DIE
Side View (a)
DIE
End View (b)
Thermal
Pad
Bottom View (c)
A. The thermal pad is electrically isolated from all terminals in the package.
Figure 51. Views of Thermally Enhanced RHF Package
(Representative Only – Not to Scale)
Copyright © 2005–2009, Texas Instruments Incorporated
Product Folder Link(s): THS6184
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