AM1808_11 Datasheet, PDF (258/265 Pages) Texas Instruments – AM1808 ARM Microprocessor

AM1808
SPRS653B – FEBRUARY 2010 – REVISED APRIL 2011
www.ti.com
X
AM1808
( ) ZKB ( ) 3
PREFIX
X = Experimental Device
P = Prototype Device
Blank = Production Device
DEVICE
SILICON REVISION^(B)
A = Silicon Revision 1.1
B = Silicon Revision 2.0 or 2.1
DEVICE SPEED RANGE
3 = 300 MHz (for revision A)
3 = 375 MHz (for revision B)
4 = 456 MHz
TEMPERATURE RANGE (JUNCTION)
Blank = 0°C to 90°C (Commercial Grade)
D = -40°C to 90°C (Industrial Grade)
A = -40°C to 105°C (Extended Grade)
PACKAGE TYPE ^(A)
ZCE = 361 Pin Plastic BGA, with Pb-free
Soldered Balls [Green], 0.65-mm Ball Pitch
ZWT = 361 Pin Plastic BGA, with Pb-free
Soldered Balls [Green], 0.80-mm Ball Pitch
A. BGA = Ball Grid Array
B. Parts marked revision B are silicon revision 2.1 if '2.1' is marked on the package, and silicon revision 2.0 if there is no
'2.1' marking.
Figure 6-1. Device Nomenclature
6.2 Documentation Support
The following documents describe the device. Copies of these documents are available on the Internet at
www.ti.com. Tip: Enter the literature number in the search box provided at www.ti.com.
Reference Guides
SPRUGM9 AM1808/AM1810 ARM Microprocessor System Reference Guide
SPRUFU0 AM17x/AM18x ARM Microprocessor Peripherals Overview Reference Guide
6.3 Community Resources
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respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
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