MSP430F533_15 Datasheet, PDF (24/112 Pages) Texas Instruments – Mixed-Signal Microcontrollers

MSP430F5338, MSP430F5336, MSP430F5335, MSP430F5333
SLAS721D – AUGUST 2010 – REVISED DECEMBER 2015
www.ti.com
5.16 Crystal Oscillator, XT2
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)^{(1) (2)}
I_DVCC,XT2
f_XT2,HF0
PARAMETER
XT2 oscillator crystal current
consumption
XT2 oscillator crystal frequency,
mode 0
TEST CONDITIONS
f_OSC = 4 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 0,
T_A = 25°C
f_OSC = 12 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 1,
T_A = 25°C
f_OSC = 20 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 2,
T_A = 25°C
f_OSC = 32 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 3,
T_A = 25°C
XT2DRIVEx = 0, XT2BYPASS = 0⁽³⁾
V_CC
MIN TYP MAX UNIT
200
260
3V
µA
325
450
4
8 MHz
f_XT2,HF1
XT2 oscillator crystal frequency,
mode 1
XT2DRIVEx = 1, XT2BYPASS = 0⁽³⁾
8
16 MHz
f_XT2,HF2
XT2 oscillator crystal frequency,
mode 2
XT2DRIVEx = 2, XT2BYPASS = 0⁽³⁾
16
24 MHz
f_XT2,HF3
XT2 oscillator crystal frequency,
mode 3
XT2DRIVEx = 3, XT2BYPASS = 0⁽³⁾
24
32 MHz
f_XT2,HF,SW
XT2 oscillator logic-level square-
wave input frequency
XT2BYPASS = 1^{(4) (3)}
0.7
32 MHz
XT2DRIVEx = 0, XT2BYPASS = 0,
f_XT2,HF0 = 6 MHz, C_L,eff = 15 pF
OA_HF
Oscillation allowance for
HF crystals⁽⁵⁾
XT2DRIVEx = 1, XT2BYPASS = 0,
f_XT2,HF1 = 12 MHz, C_L,eff = 15 pF
XT2DRIVEx = 2, XT2BYPASS = 0,
f_XT2,HF2 = 20 MHz, C_L,eff = 15 pF
XT2DRIVEx = 3, XT2BYPASS = 0,
f_XT2,HF3 = 32 MHz, C_L,eff = 15 pF
t_START,HF Start-up time
f_OSC = 6 MHz
XT2BYPASS = 0, XT2DRIVEx = 0,
T_A = 25°C, C_L,eff = 15 pF
3V
f_OSC = 20 MHz
XT2BYPASS = 0, XT2DRIVEx = 3,
T_A = 25°C, C_L,eff = 15 pF
C_L,eff
Integrated effective load
capacitance, HF mode^{(6) (1)}
450
320
Ω
200
200
0.5
ms
0.3
1
pF
f_Fault,HF
Duty cycle
Oscillator fault frequency⁽⁷⁾
Measured at ACLK, f_XT2,HF2 = 20 MHz
XT2BYPASS = 1⁽⁸⁾
40%
30
50%
60%
300 kHz
(1) Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(2) To improve EMI on the XT2 oscillator the following guidelines should be observed.
• Keep the traces between the device and the crystal as short as possible.
• Design a good ground plane around the oscillator pins.
• Prevent crosstalk from other clock or data lines into oscillator pins XT2IN and XT2OUT.
• Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins.
• Use assembly materials and processes that avoid any parasitic load on the oscillator XT2IN and XT2OUT pins.
• If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
(3) Maximum frequency of operation of the entire device cannot be exceeded.
(4) When XT2BYPASS is set, the XT2 circuit is automatically powered down.
(5) Oscillation allowance is based on a safety factor of 5 for recommended crystals.
(6) Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, TI recommends verifying the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
(7) Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
(8) Measured with logic-level input frequency but also applies to operation with crystals.
24
Specifications
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