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AM1806_11 Datasheet, PDF (237/244 Pages) Texas Instruments – AM1806 ARM Microprocessor
AM1806
www.ti.com
SPRS658C – FEBRUARY 2010 – REVISED APRIL 2011
X
AM1806
( ) ZWT ( ) 3
PREFIX
X = Experimental Device
P = Prototype Device
Blank = Production Device
DEVICE
(B)
SILICON REVISION
B = Silicon Revision 2.0 or 2.1
DEVICE SPEED RANGE
3 = 375 MHz
4 = 456 MHz
TEMPERATURE RANGE (JUNCTION)
Blank = 0°C to 90°C (Commercial Grade)
D = -40°C to 90°C (Industrial Grade)
A = -40°C to 105°C (Extended Grade)
PACKAGE TYPE(A)
ZCE = 361 Pin Plastic BGA, with Pb-free
Soldered Balls [Green], 0.65-mm Ball Pitch
ZWT = 361 Pin Plastic BGA, with Pb-free
Soldered Balls [Green], 0.80-mm Ball Pitch
A. BGA = Ball Grid Array
B. Parts marked revision B are silicon revision 2.1 if '2.1' is marked on the package, and silicon revision 2.0 if there is no
'2.1' marking.
Figure 6-1. Device Nomenclature
6.2 Documentation Support
The following documents describe the device. Copies of these documents are available on the Internet at
www.ti.com. Tip: Enter the literature number in the search box provided at www.ti.com.
Reference Guides
SPRUGU4 AM1806 ARM Microprocessor System Reference Guide
SPRUFU0 AM17x/AM18x ARM Microprocessor Peripherals Overview Reference Guide
6.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and
help solve problems with fellow engineers.
TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help
developers get started with Embedded Processors from Texas Instruments and to foster
innovation and growth of general knowledge about the hardware and software surrounding
these devices.
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