DS90CR285MTDX Datasheet, PDF (20/25 Pages) Texas Instruments – DS90CR285/DS90CR286 +3.3V Rising Edge Data Strobe LVDS 28-Bit Channel Link-66 MHz

PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
DS90CR285MTD
Status Package Type Package Pins Package
(1)
Drawing
Qty
ACTIVE TSSOP
DGG 56
34
Eco Plan
(2)
TBD
Lead/Ball Finish
Call TI
MSL Peak Temp
(3)
Call TI
Op Temp (°C)
-40 to 85
DS90CR285MTD/NOPB
DS90CR285MTDX
ACTIVE
ACTIVE
TSSOP
TSSOP
DGG 56
34 Green (RoHS
& no Sb/Br)
DGG 56 1000
TBD
CU SN
Call TI
Level-2-260C-1 YEAR -40 to 85
Call TI
-40 to 85
DS90CR285MTDX/NOPB
DS90CR286MTD
ACTIVE
NRND
TSSOP
TSSOP
DGG 56 1000 Green (RoHS
& no Sb/Br)
DGG 56
34
TBD
CU SN
Call TI
Level-2-260C-1 YEAR -40 to 85
Call TI
DS90CR286MTD/NOPB
DS90CR286MTDX/NOPB
NRND
NRND
TSSOP
TSSOP
DGG 56
34 Green (RoHS
& no Sb/Br)
DGG 56 1000 Green (RoHS
& no Sb/Br)
CU SN
CU SN
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
(1) _{The marketing status values are defined as follows:}
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Top-Side Markings
(4)
DS90CR285MTD
>B
DS90CR285MTD
>B
DS90CR285MTD
>B
DS90CR285MTD
>B
DS90CR286MTD
>B
DS90CR286MTD
>B
DS90CR286MTD
>B
(2) _{Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability}
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) _{MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.}
(4) _{Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a}
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Samples
Addendum-Page 1