LMH6521_16 Datasheet, PDF (2/29 Pages) Texas Instruments – High Performance Dual DVGA

LMH6521
SNOSB47D – MAY 2011 – REVISED MARCH 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings ⁽¹⁾⁽²⁾
ESD Tolerance ⁽³⁾
Human Body Model
Machine Model
Charged Device Model
Positive Supply Voltage (Pin 14, 27)
Differential Voltage between Any Two Grounds
Analog Input Voltage Range
Digital Input Voltage Range
Junction Temperature
Storage Temperature Range
Soldering Information
Infrared or Convection (30 sec)
2 kV
200V
750V
−0.6V to 5.5V
<200 mV
−0.6V to V+
−0.6V to 5.5V
+150°C
−65°C to +150°C
260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
Operating Ratings ⁽¹⁾
Supply Voltage (Pin 14 & 27)
4.75V to 5.25V
Differential Voltage Between Any Two Grounds
<10 mV
Analog Input Voltage Range, AC Coupled
Ambient Temperature Range ⁽²⁾
0V to V+
−40°C to +85°C
Package Thermal Resistance (θ_JA)
45°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical
Characteristics tables.
(2) The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) – T_A)/ θ_JA. All numbers apply for packages soldered directly onto a PC Board.
2
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