BQ500101 Datasheet, PDF (2/20 Pages) Texas Instruments – NexFET Power Stage

bq500101
SLPS585 – MARCH 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 5
7 Detailed Description .............................................. 6
7.1 Overview ................................................................... 6
7.2 Functional Block Diagram ......................................... 6
7.3 Feature Description................................................... 7
8 Application and Implementation .......................... 8
8.1 Application Information.............................................. 8
8.2 Typical Application ................................................... 8
8.3 System Example ..................................................... 11
9 Layout ................................................................... 13
9.1 Layout Guidelines ................................................... 13
9.2 Layout Example ...................................................... 13
9.3 Thermal Considerations .......................................... 14
10 Device and Documentation Support ................. 15
10.1 Trademarks ........................................................... 15
10.2 Electrostatic Discharge Caution ............................ 15
10.3 Glossary ................................................................ 15
11 Mechanical, Packaging, and Orderable
Information ........................................................... 16
11.1 Mechanical Drawing.............................................. 16
11.2 Recommended PCB Land Pattern........................ 17
11.3 Recommended Stencil Opening ........................... 17
4 Revision History
DATE
March 2016
REVISION
*
NOTES
Initial release.
2
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