TLK1501_12 Datasheet, PDF (19/32 Pages) Texas Instruments – 0.6 TO 1.5 GBPS TRANSCEIVER

TLK1501
0.6 TO 1.5 GBPS TRANSCEIVER
R_θJA
R_θJC
SLLS428F − JUNE 2000 − REVISED JANUARY 2004
THERMAL INFORMATION
PARAMETER
TEST CONDITION
Board-mounted, no air flow, high conductivity TI recommended test
board, chip soldered or greased to thermal land
Junction-to-free-air
thermal resistance
Board-mounted, no air flow, high conductivity TI recommended test
board with thermal land but no solder or grease thermal connection to
thermal land
Board-mounted, no air flow, JEDEC test board
Board-mounted, no air flow, high conductivity TI recommended test
board, chip soldered or greased to thermal land
Junction-to-case thermal Board-mounted, no air flow, high conductivity TI recommended test
resistance
board with thermal land but no solder or grease thermal connection to
thermal land
Board-mounted, no air flow, JEDEC test board
MIN TYP MAX UNIT
21.47
42.20
°C/W
75.83
0.38
0.38
°C/W
7.8
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