TLK1501_12 Datasheet, PDF (15/32 Pages) Texas Instruments – 0.6 TO 1.5 GBPS TRANSCEIVER

TLK1501
0.6 TO 1.5 GBPS TRANSCEIVER
SLLS428F − JUNE 2000 − REVISED JANUARY 2004
absolute maximum ratings over operating free-air temperature (unless otherwise noted)^†
Supply voltage, V_DD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 to 3 V
Voltage range at TXD, ENABLE, GTX_CLK, TX_EN, TX_ER, LOOPEN, PRBS_PASS . . . . . . . . . . −0.3 to 4 V
Voltage range at any other terminal except above . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 to V_DD+0.3 V
Package power dissipation, P_D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Storage temperature, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HBM:3 KV, CDM:1.5 KV
Characterized free-air operating temperature range, T_A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values, except differential I/O bus voltages, are with respect to network ground.
DISSIPATION RATING TABLE
PACKAGE
RCP64§
TA ≤ 2 5_C
POWER RATING
5.25 W
DERATING FACTOR^‡
ABOVE TA = 25_C
46.58 mW/_C
RCP64¶
3.17 W
23.70 mW/_C
RCP64#
2.01 W
13.19 mW/_C
‡ _{This is the inverse of the traditional junction-to-ambient thermal resistance (RθJA).}
§ _{2 oz. Trace and copper pad with solder.}
¶ _{2 oz. Trace and copper pad without solder.}
# _{Standard JEDEC High-K board.}
TA = 70_C
POWER RATING
2.89 W
1.74 W
1.11 W
For more information, refer to TI application note PowerPAD Thermally Enhanced Package, TI literature
number SLMA002.
electrical characteristics over recommended operating conditions
PARAMETER
TEST CONDITIONS
Supply voltage, VDD
Supply current, ICC
Power dissipation, PD
Shutdown current
PLL startup lock time
Data acquisition time
VDD = 2.5 V, Frequency = 0.6 Gbps, PRBS pattern
VDD = 2.5 V, Frequency = 1.5 Gbps, PRBS pattern
VDD = 2.5 V, Frequency = 0.6 Gbps, PRBS pattern
VDD = 2.5 V, Frequency = 1.5 Gbps, PRBS pattern
VDD = 2.5 V, Frequency = 1.5 Gbps, worst case pattern||
Enable = 0, VDDA + VDD terminals = max
VDD,VDDA = 2.3V, EN ↑ to PLL acquire
Operating free-air temperature, TA
|| _{Worst case pattern is a pattern that creates a maximum transition density on the serial transceiver.}
MIN NOM MAX UNIT
2.3 2.5 2.7 V
70
mA
100
175
mW
250
mW
350 mW
2
mA
0.1 0.4 ms
1024
bits
−40
85 °C
reference clock (GTX_CLK) timing requirements over recommended operating conditions (unless
otherwise noted)
PARAMETER
Frequency
Frequency
Frequency tolerance
Duty cycle
Jitter
TEST CONDITIONS
Minimum data rate
Maximum data rate
Peak-to-peak
MIN
Typ −0.01%
Typ −0.01%
− 100
40%
TYP MAX
30 Typ+0.01%
75 Typ+0.01%
50%
60%
40
UNIT
MHz
MHz
ppm
ps
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