TMS320DM8168_13 Datasheet, PDF (179/327 Pages) Texas Instruments – TMS320DM816x DaVinci Video Processors

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TMS320DM8168, TMS320DM8167
TMS320DM8166, TMS320DM8165
SPRS614D – MARCH 2011 – REVISED JANUARY 2013
Complete stackup specifications are provided in Table 8-4.
Table 8-4. PCB Stackup Specifications
NO.
PARAMETER
MIN
TYP
MAX UNIT
1 PCB routing and plane layers
6
2 Signal routing layers
3
3 Full ground layers under DDR2 routing region
2
4 Number of ground plane cuts allowed within DDR routing region
0
5 Number of ground reference planes required for each DDR2 routing layer
1
6 Number of layers between DDR2 routing layer and reference ground plane
0
7 PCB routing feature size
4
Mils
8 PCB trace width, w
9 PCB BGA escape via pad size⁽¹⁾
10 PCB BGA escape via hole size⁽¹⁾
4
Mils
18
20 Mils
10
Mils
11 Processor BGA pad size
12 DDR2 device BGA pad size⁽²⁾
0.3
mm
13 Single-ended impedance, Zo
14 Impedance control⁽³⁾
50
75 Ω
Z-5
Z
Z+5 Ω
(1) A 20/10 via may be used if enough power routing resources are available. An 18/10 via allows for more flexible power routing to the
processor.
(2) For the DDR2 device BGA pad size, see the DDR2 device manufacturer documentation.
(3) Z is the nominal singled-ended impedance selected for the PCB specified by item 13.
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Peripheral Information and Timings 179
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