MSP430F5510_17 Datasheet, PDF (100/118 Pages) Texas Instruments – Mixed-Signal Microcontrollers

MSP430F5510, MSP430F5509, MSP430F5508
MSP430F5507, MSP430F5506, MSP430F5505, MSP430F5504
MSP430F5503, MSP430F5502, MSP430F5501, MSP430F5500
SLAS645J – JULY 2009 – REVISED APRIL 2015
MSP 430 F 5 438 A I ZQW T XX
Processor Family
Optional: Additional Features
430 MCU Platform
Optional: Tape and Reel
Device Type
Packaging
Series
Feature Set
Optional: Temperature Range
Optional: A = Revision
Processor Family
430 MCU Platform
Device Type
Series
CC = Embedded RF Radio
MSP = Mixed-Signal Processor
XMS = Experimental Silicon
PMS = Prototype Device
TI’s Low-Power Microcontroller Platform
Memory Type
C = ROM
F = Flash
FR = FRAM
G = Flash or FRAM (Value Line)
L = No Nonvolatile Memory
Specialized Application
AFE = Analog Front End
BT = Preprogrammed with Bluetooth
BQ = Contactless Power
CG = ROM Medical
FE = Flash Energy Meter
FG = Flash Medical
FW = Flash Electronic Flow Meter
1 Series = Up to 8 MHz
2 Series = Up to 16 MHz
3 Series = Legacy
4 Series = Up to 16 MHz with LCD
5 Series = Up to 25 MHz
6 Series = Up to 25 MHz with LCD
0 = Low-Voltage Series
Feature Set
Various Levels of Integration Within a Series
Optional: A = Revision
Optional: Temperature Range
N/A
S = 0°C to 50°C
C = 0°C to 70°C
I = –40°C to 85°C
T = –40°C to 105°C
Packaging
http://www.ti.com/packaging
Optional: Tape and Reel
T = Small Reel
R = Large Reel
No Markings = Tube or Tray
Optional: Additional Features -EP = Enhanced Product (–40°C to 105°C)
-HT = Extreme Temperature Parts (–55°C to 150°C)
-Q1 = Automotive Q100 Qualified
Figure 7-1. Device Nomenclature
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Product Folder Links: MSP430F5510 MSP430F5509 MSP430F5508 MSP430F5507 MSP430F5506 MSP430F5505
MSP430F5504 MSP430F5503 MSP430F5502 MSP430F5501 MSP430F5500