CC430F613X_12 Datasheet, PDF (85/121 Pages) Texas Instruments – MSP430™ SoC with RF Core

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ECCN 5E002 TSPA - Technology / Software Publicly Available
CC430F613x
CC430F612x
CC430F513x
SLAS554F – MAY 2009 – REVISED DECEMBER 2011
Frequency Synthesizer Characteristics
T_A = 25°C, V_CC = 3 V (unless otherwise noted)⁽¹⁾
MIN figures are given using a 27MHz crystal. TYP and MAX figures are given using a 26MHz crystal.
PARAMETER
Programmed frequency resolution⁽²⁾
Synthesizer frequency tolerance⁽³⁾
TEST CONDITIONS
26- to 27-MHz crystal
MIN
397
TYP
f_XOSC/2¹⁶
±40
50-kHz offset from carrier
–95
100-kHz offset from carrier
–94
200-kHz offset from carrier
–94
RF carrier phase noise
500-kHz offset from carrier
1-MHz offset from carrier
–98
–107
2-MHz offset from carrier
–112
5-MHz offset from carrier
–118
PLL turn-on / hop time⁽⁴⁾
PLL RX/TX settling time⁽⁵⁾
PLL TX/RX settling time⁽⁶⁾
PLL calibration time⁽⁷⁾
10-MHz offset from carrier
Crystal oscillator running
–129
85.1
88.4
9.3
9.6
20.7
21.5
694
721
MAX
412
88.4
9.6
21.5
721
UNIT
Hz
ppm
dBc/Hz
µs
µs
µs
µs
(1) All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 48).
(2) The resolution (in Hz) is equal for all frequency bands.
(3) Depends on crystal used. Required accuracy (including temperature and aging) depends on frequency band and channel bandwidth /
spacing.
(4) Time from leaving the IDLE state until arriving in the RX, FSTXON, or TX state, when not performing calibration.
(5) Settling time for the 1-IF frequency step from RX to TX
(6) Settling time for the 1-IF frequency step from TX to RX
(7) Calibration can be initiated manually or automatically before entering or after leaving RX/TX.
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