CC430F613X_12 Datasheet, PDF (3/121 Pages) Texas Instruments – MSP430™ SoC with RF Core

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ECCN 5E002 TSPA - Technology / Software Publicly Available
CC430F613x
CC430F612x
CC430F513x
SLAS554F – MAY 2009 – REVISED DECEMBER 2011
T_A
–40°C to 85°C
ORDERING INFORMATION⁽¹⁾
PACKAGED DEVICES⁽²⁾
PLASTIC 64-PIN QFN (RGC)
PLASTIC 48-PIN QFN (RGZ)
CC430F6137IRGC
CC430F5137IRGZ
CC430F6135IRGC
CC430F5135IRGZ
CC430F6127IRGC
CC430F5133IRGZ
CC430F6126IRGC
CC430F6125IRGC
(1) For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Copyright © 2009–2011, Texas Instruments Incorporated
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