DRV5013_15 Datasheet, PDF (5/27 Pages) Texas Instruments – DRV5013 Digital-Latch Hall Effect Sensor

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DRV5013
SLIS150C – MARCH 2014 – REVISED SEPTEMBER 2014
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾
Power supply voltage
Output terminal voltage
Output terminal reverse current during
reverse supply condition
Operating junction temperature, T_J
V_CC
Voltage ramp rate (V_CC), V_CC < 5 V
Voltage ramp rate (V_CC), V_CC > 5 V
OUT
OUT
MIN
–22 ⁽²⁾
MAX
40
Unlimited
0
2
–0.5
40
0
100
–40
150 ⁽³⁾
UNIT
V
V/µs
V
mA
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Ensured by design. Only tested to –20 V.
(3) Tested in production to T_A = 125°C.
7.2 Handling Ratings
T_stg
V_(ESD)
Storage temperature range
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins⁽¹⁾
Charged device model (CDM), per JEDEC specification JESD22-C101, all
pins ⁽²⁾
MIN
–65
–2500
–500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
MAX
150
2500
500
UNIT
°C
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_CC
V_O
I_SINK
T_A
Power supply voltage
Output terminal voltage (OUT)
Output terminal current sink (OUT)⁽¹⁾
Operating ambient temperature
(1) Power dissipation and thermal limits must be observed
MIN
MAX
UNIT
2.5
38
V
0
38
V
0
30
mA
–40
125
°C
7.4 Thermal Information
THERMAL METRIC⁽¹⁾
DBZ
(3 PINS)
LPG
(3 PINS)
UNIT
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
333.2
99.9
66.9
4.9
65.2
180
98.6
154.9
40
154.9
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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