TMS320DM6441_08 Datasheet, PDF (229/232 Pages) Texas Instruments – Digital Media System-on-Chip

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8 Mechanical Packaging and Orderable Information
TMS320DM6441
Digital Media System-on-Chip
SPRS359D – SEPTEMBER 2006 – REVISED MARCH 2008
The following table(s) show the thermal resistance characteristics for the PBGA–ZWT mechanical
package.
8.1 Thermal Data for ZWT
Table 8-1. Thermal Resistance Characteristics (PBGA Package) [ZWT]
NO.
C/W ⁽¹⁾
AIR FLOW (m/s)⁽²⁾
1
RΘ_JC
2
RΘ_JB
3
Junction-to-case
Junction-to-board
6.54
N/A
15.62
N/A
29.75
0.00
4
5
RΘ_JA
Junction-to-free air
26.78
1.0
26.20
2.00
6
25.80
3.00
7
0.11
0.00
8
9
Psi_JT
Junction-to-package top
0.15
1.0
0.16
2.00
10
0.16
3.00
11
14.79
0.00
12
13
Psi_JB
Junction-to-board
14.66
1.0
14.66
2.00
14
14.66
3.00
(1) These measurements were conducted in a JEDEC defined 1S2P system and will change based on environment as well as application.
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages.
(2) m/s = meters per second
8.1.1 Packaging Information
The following packaging information and addendum reflect the most current data available for the
designated device(s). This data is subject to change without notice and without revision of this document.
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