TLK2701 Datasheet, PDF (20/21 Pages) Texas Instruments – 1.6 TO 2.7 GBPS TRANSCEIVER

TLK2701
1.6 TO 2.7 GBPS TRANSCEIVER
SLLS429B – AUGUST 2000 – REVISED MAY 2002
RCP (S-PQFP-G64)
0,50
48
MECHANICAL DATA
PowerPAD PLASTIC QUAD FLATPACK
0,27
0,17
33
0,08 M
49
32
Thermal Pad
(See Note D)
64
17
1
0,85
0,75
16
7,50 TYP
10,20
9,80 ^SQ
12,20
11,80 ^SQ
1,00 MAX
0,15
0,05
Seating Plane
0,08
0,13 NOM
Gage Plane
0,25
0° – 7°
0,75
0,45
4147711/A 10/98
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MS-026
PowerPAD is a trademark of Texas Instruments.
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