GC5318 Datasheet, PDF (2/45 Pages) Texas Instruments – HIGH-DENSITY DIGITAL UPCONVERTER

GC5318
HIGH-DENSITY DIGITAL UPCONVERTER
SLWS187 – JULY 2006
1.1.2 Functional Block Diagram
Transmit Output Data
(to D/A Converters)
www.ti.com
Transmit Output
Interface
I&Q
DUC0
2CDMA2000-1X
or 1 UMTS
sync
DUC1
2CDMA2000-1X
or 1 UMTS
DUCs 2-9
sync
DUC10
2CDMA2000-1X
or 1 UMTS
DUC11
2CDMA2000-1X
or 1 UMTS
sync
txclk
control
trst_n
tck
tdi
tms
JTAG
4
tx_sync a-d
reset_n
Control & Sync
tdo
16
6
d0 - d15 a0 - a5 rd_n wr_n ce_n
1.1.3 Package/Ordering Information
PRODUCT
GC5318
PACKAGE-LEAD
Thermally-Enhanced
Plastic BGA
with Heat Slug – 388
PACKAGE
DESIGNATOR
ZED
SPECIFIED
TEMPERATURE
RANGE
–40°C to +85°C
PACKAGE
MARKING
GC5318IZED
tx_sync_out
interrupt
ORDERING
NUMBER
GC5318IZED
TRANSPORT
MEDIA,
QUANTITY
Tray, 40
2
Introduction