OMAP-L138_10 Datasheet, PDF (118/268 Pages) Texas Instruments – Low-Power Applications Processor

OMAP-L138 Low-Power Applications Processor
SPRS586A – JUNE 2009 – REVISED AUGUST 2009
www.ti.com
6.11.3.4 Placement
Figure 6-19 shows the required placement for the OMAP-L138 device as well as the DDR2/mDDR
devices. The dimensions for Figure 6-20 are defined in Table 6-29. The placement does not restrict the
side of the PCB that the devices are mounted on. The ultimate purpose of the placement is to limit the
maximum trace lengths and allow for proper routing space. For single-memory DDR2/mDDR systems, the
second DDR2/mDDR device is omitted from the placement.
X
A1
Y
OFFSET
Y
DDR2/mDDR
Device
Y
OFFSET
A1
Recommended DDR2/mDDR
Device Orientation
Figure 6-20. OMAP-L138 and DDR2/mDDR Device Placement
Table 6-29. Placement Specifications
No. Parameter
1X
2Y
3 Y Offset
4 Clearance from non-DDR2/mDDR signal to DDR2/mDDR Keepout Region
Min Max Unit
Notes
1750 Mils See Notes ⁽¹⁾, ⁽²⁾
1280 Mils See Notes ⁽¹⁾, ⁽²⁾
650 Mils See Notes ⁽¹⁾. ⁽²⁾, ⁽³⁾
4
w See Note ⁽⁴⁾
(1) See Figure 6-20 for dimension definitions.
(2) Measurements from center of device to center of DDR2/mDDR device.
(3) For single memory systems it is recommended that Y Offset be as small as possible.
(4) Non-DDR2/mDDR signals allowed within DDR2/mDDR keepout region provided they are separated from DDR2/mDDR routing layers by
a ground plane.
118 Peripheral Information and Electrical Specifications
Submit Documentation Feedback