TLK1201IRCPRG4 Datasheet, PDF (10/22 Pages) Texas Instruments – ETHERNET TRANSCEIVERS

TLK1201RCP, TLK1201IRCP
ETHERNET TRANSCEIVERS
SLLS506E − AUGUST 2001 − REVISED MAY 2007
absolute maximum ratings over operating free-air temperature (unless otherwise noted)^†
Supply voltage, V_DD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 3 V
Input voltage range at TTL terminals, V_I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4 V
Input voltage range at any other terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V_DD +0.3 V
Storage temperature, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CDM: 1 kV, HBM:2 kV
Characterized free-air operating temperature range: TLK1201 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
TLK1201I . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
DISSIPATION RATING TABLE
PACKAGE
RCP64^§
T_A ≤ 25°C
POWER RATING
5.25 W
OPERATING FACTOR^‡
ABOVE T_A = 25°C
46.58 mW/°C
T_A = 70°C
POWER RATING
2.89 W
RCP64^¶
3.17 W
23.70 mW/°C
1.74 W
RCP64^#
2.01 W
13.19 mW/°C
1.11 W
‡ _{This is the inverse of the traditional junction-to-ambient thermal resistance (RθJA).}
§ _{2 oz. Trace and copper pad with solder}
¶ _{2 oz. Trace and copper pad without solder}
# _{Standard JEDEC high-K board}
NOTE: For more information, see the TI application note PowerPAD Thermally Enhanced
Package, TI literature number SLMA002.
thermal characteristics
PARAMETER
R_θJA Junction-to-free-air thermal resistance
R_θJC Junction-to-case-thermal resistance
TEST CONDITION
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased to
thermal land
Board-mounted, no air flow, high conductivity TI
recommended test board with thermal land but no
solder or grease thermal connection to thermal land
Board-mounted, no air flow, JEDEC test board
Board-mounted, no air flow, high conductivity TI
recommended test board, chip soldered or greased to
thermal land
Board-mounted, no air flow, high conductivity TI
recommended test board with thermal land but no
solder or grease thermal connection to thermal land
Board-mounted, no air flow, JEDEC test board
MIN TYP MAX UNIT
21.47
°C/W
42.2
75.83
0.38
°C/W
0.38
7.8
10
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