LSM330DLC Datasheet, PDF (64/66 Pages) STMicroelectronics – iNEMO inertial module: 3D accelerometer and 3D gyroscope

Package information
9
Package information
LSM330DLC
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK is an ST trademark.
Figure 23. LGA-28 (4x5x1.1 mm): mechanical data and package dimensions
Ref.
A1
A2
A3
D1
E1
L1
L2
N1
M
P1
P2
T1
T2
d
k
h
Dimensions
mm
Min.
Typ.
3.850
4.850
0.265
0.19
0.855
0.200
4.000
5.000
3.75
2.75
0.500
0.075
2.200
1.700
0.325
0.250
0.200
0.050
0.100
Max.
1.1
4.150
5.150
0.385
0.310
Outline and
mechanical data
LGA-28 (4x5x1.1mm)
Land Grid Array Package
64/66
Doc ID 022162 Rev 2
8181393A