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| LSM330DLC Datasheet, PDF (31/66 Pages) STMicroelectronics – iNEMO inertial module: 3D accelerometer and 3D gyroscope | |||
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LSM330DLC
Application hints
5.2
Soldering information
The LGA package is compliant with ECOPACK®, RoHS and âGreenâ standards. It is
qualified for soldering heat resistance according to JEDEC J-STD-020D.
Leave âPin 1 Indicatorâ unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com/mems.
Doc ID 022162 Rev 2
31/66
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