TDA7590_09 Datasheet, PDF (40/42 Pages) STMicroelectronics – Digital signal processing IC for speech and audio applications

Package information
9
Package information
TDA7590
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK^® packages, depending on their level of environmental compliance. ECOPACK^®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK^® is an ST trademark.
Figure 3. TQFP144 mechanical data and package dimensions
mm
inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A
1.20
0.047
A1 0.05
0.15 0.002
0.006
A2 0.95 1.00 1.05 0.037 0.039 0.041
B 0.17 0.22 0.27 0.007 0.009 0.011
C 0.09
0.20 0.003
0.008
D 21.80 22.00 22.20 0.858 0.866 0.874
D1 19.80 20.00 20.20 0.779 0.787 0.795
D2 2.00
0.079
D3
17.50
0.689
E 21.80 22.00 22.20 0.858 0.866 0.874
E1 19.80 20.00 20.20 0.779 0.787 0.795
E2 2.00
0.079
E3
17.50
0.689
e
0.50
0.020
L 0.45 0.60 0.75 0.018 0.024 0.030
L1
1.00
0.0393
K
0˚ (min.), 3.5˚ (typ.), 7˚(max.)
ccc
0.08
0.03
Note 1: Exact shape of each corner is optional.
OUTLINE AND
MECHANICAL DATA
TQFP144
(20x20x1.0mm exposed pad down)
40/42
7386636 B