LAN91C100FD_0601 Datasheet, PDF (77/78 Pages) SMSC Corporation – FEAST Fast Ethernet Controller with Full Duplex Capability

FEAST Fast Ethernet Controller with Full Duplex Capability
Chapter 10 Package Outlines
Figure 10.1 - 208 Pin QFP Package Outline
Table 10.1 - 208 Pin QFP Package Parameters
MIN
NOMINAL
MAX
REMARK
A
~
~
4.07
Overall Package Height
A1
0.05
~
0.5
Standoff
A2
3.17
~
3.67
Body Thickness
D
30.35
~
30.85
X Span
D1
27.90
~
28.10
X Body Size
E
30.35
~
30.85
Y Span
E1
27.90
~
28.10
Y body Size
H
0.09
~
0.20
Lead Frame Thickness
L
0.45
0.60
0.75
Lead Foot Length
L1
~
1.30
~
Lead Length
e
0.50 Basic
θ
0^o
~
7^o
Lead Pitch
Lead Foot Angle
W
0.10
~
0.30
Lead Width
R1
0.08
~
~
Lead Shoulder Radius
R2
0.08
~
0.25
Lead Foot Radius
ccc
~
~
0.08
Coplanarity
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC DS – LAN91C100FD Rev. D
Page 77
DATASHEET
Rev. 01-20-06