SI598 Datasheet, PDF (11/28 Pages) Silicon Laboratories – Programmable with 28 parts per trillion frequency resolution

Si598/Si599
Table 13. Thermal Characteristics
(Typical values TA = 25 ºC, V_DD = 3.3 V)
Parameter
Symbol Test Condition Min
Typ
Max Unit
Thermal Resistance Junction to Ambient
_JA
Thermal Resistance Junction to Case
_JC
Still Air
Still Air
—
84.6
— °C/W
—
38.8
— °C/W
Ambient Temperature
T_A
Junction Temperature
T_J
–40
—
85
°C
—
—
125
°C
Table 14. Absolute Maximum Ratings
Parameter
Symbol
Rating
Units
Supply Voltage, 1.8 V Option
Supply Voltage, 2.5/3.3 V Option
Input Voltage
Storage Temperature
ESD Sensitivity (HBM, per JESD22-A114)
V_DD
–0.5 to +1.9
V
V_DD
–0.5 to +3.8
V
V_I
–0.5 to V_DD + 0.3
V
T_S
–55 to +125
ºC
ESD
2000
V
Soldering Temperature (lead-free profile)
Soldering Temperature Time @ T_PEAK (lead-free profile)
T_PEAK
t_P
260
20–40
ºC
seconds
Notes:
1. Stresses beyond the absolute maximum ratings may cause permanent damage to the device. Functional operation or
specification compliance is not implied at these conditions.
2. The device is compliant with JEDEC J-STD-020C. Refer to Si5xx Packaging FAQ available for download at
www.silabs.com/VCXO for further information, including soldering profiles.
Rev. 1.0
11