K4R271669F Datasheet, PDF (4/20 Pages) Samsung semiconductor – 128Mbit RDRAM(F-die)

K4R271669F
Direct RDRAM^™
Pinouts and Definitions
The following table shows the pin assignments of the center-
bonded RDRAM package.
Table 1: Center-Bonded CSP Device (Top View)
7
DQA7
DQA4
CFM
CFMN
RQ5
RQ3
6
GND
DQA5
DQA2
VDDA
RQ6
RQ2
5
CMD
VDD
GND
GNDA
VDD
GND
4
3
SCK
GND
VDD
GND
GND
VDD
2
VCMOS
DQA6
DQA1
VREF
RQ7
RQ1
1
NC
DQA3
DQA0
CTMN
CTM
RQ4
Top View
A
B
C
D
E
F
DQB0
DQB1
VDD
GND
DQB2
RQ0
G
DQB4
DQB5
VDD
GND
DQB6
DQB3
H
DQB7
GND
SIO0
SIO1
VCMOS
NC
J
b. Top marking example
SEC 240 xCS8
K4R271669F
For consumer package, pin #1(ROW 1, COL A) is
located at the A1 position on the top side and the A1
• position is marked by the marker “ “.
Top View
Chip
Page 2
Version 1.41 Jan. 2004