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K4R271669F Datasheet, PDF (16/20 Pages) Samsung semiconductor – 128Mbit RDRAM(F-die)
K4R271669F
Direct RDRAM™
Timing Characteristics
Table 12: Timing Characteristics
Symbol
tQ
tQR, tQF
tQ1
tHR
tQR1, tQF1
tPROP1
tNAPXA
tNAPXB
tPDNXA
tPDNXB
tAS
tSA
tASN
tASP
Parameter
CTM-to-DQA/DQB output time @ tCYCLE=2.50ns
DQA/DQB output rise and fall times
SCK(neg)-to-SIO0 delay @ CLOAD,MAX = 20pF (SD read data valid).
SCK(pos)-to-SIO0 delay @ CLOAD,MAX = 20pF (SD read data hold).
SIOOUT rise/fall @ CLOAD,MAX = 20pF
SIO0-to-SIO1 or SIO1-to-SIO0 delay @ CLOAD,MAX = 20pF
NAP exit delay - phase A
NAP exit delay - phase B
PDN exit delay - phase A
PDN exit delay - phase B
ATTN-to-STBY power state delay
STBY-to-ATTN power state delay
ATTN/STBY-to-NAP power state delay
ATTN/STBY-to-PDN power state delay
Min
-0.310
0.2
-
2
-
-
-
-
-
-
-
-
-
-
Max
+0.310
0.45
10
-
12
20
50
40
4
9000
1
0
8
8
Unit Figure(s)
ns
ns
ns
ns
ns
ns
ns
ns
µs
tCYCLE
tCYCLE
tCYCLE
tCYCLE
tCYCLE
Figure 58
Figure 58
Figure 61
Figure 61
Figure 61
Figure 61
Figure 50
Figure 50
Figure 50
Figure 50
Figure 48
Figure 48
Figure 49
Figure 49
Page 14
Version 1.41 Jan. 2004