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K4H560438D-GC Datasheet, PDF (18/26 Pages) Samsung semiconductor – DDR 256Mb
K4H560838D
DDR SDRAM
Parameter
Symbol
B3
(DDR333)
Min
Max
A2
(DDR266A)
Min
Max
B0
(DDR266B)
Min
Max
Unit Note
Mode register set cycle time
tMRD
12
15
DQ & DM setup time to DQS
tDS
0.45
0.5
15
ns
0.5
ns
7,8,9
DQ & DM hold time to DQS
tDH
0.45
0.5
0.5
ns
7,8,9
Control & Address input pulse width
tIPW
2.2
2.2
2.2
ns
DQ & DM input pulse width
Power down exit time
tDIPW
1.75
tPDEX
6
1.75
7.5
1.75
ns
7.5
ns
Exit self refresh to non-Read command tXSNR
75
75
75
ns
4
Exit self refresh to read command
tXSRD
200
200
200
tCK
Refresh interval time
tREFI
7.8
7.8
7.8
us
1
Output DQS valid window
tQH
tHP
-tQHS
-
tHP
-tQHS
-
tHP
-tQHS
-
ns
5
Clock half period
tHP
tCLmin
or tCHmin
-
tCLmin
or tCHmin
-
tCLmin
or tCHmin
-
ns
Data hold skew factor
tQHS
0.5
0.75
0.75
ns
DQS write postamble time
tWPST
0.4
0.6
0.4
0.6
0.4
0.6
Active to Read with Auto precharge
command
tRAP
18
20
20
Autoprecharge write recovery +
Precharge time
tDAL
(tWR/tCK)
+
(tRP/tCK)
(tWR/tCK)
+
(tRP/tCK)
(tWR/tCK)
+
(tRP/tCK)
tCK
3
tCK
11
1. Maximum burst refresh cycle : 8
2. The specific requirement is that DQS be valid(High or Low) on or before this CK edge. The case shown(DQS going from
High_Z to logic Low) applies when no writes were previously in progress on the bus. If a previous write was in progress,
DQS could be High at this time, depending on tDQSS.
3. The maximum limit for this parameter is not a device limit. The device will operate with a great value for this parameter,
but system performance (bus turnaround) will degrade accordingly.
4. A write command can be applied with tRCD satisfied after this command.
5. For registered DIMMs, tCL and tCH are ≥ 45% of the period including both the half period jitter (tJIT(HP)) of the PLL and the half period
jitter due to crosstalk (tJIT(crosstalk)) on the DIMM.
6. Input Setup/Hold Slew Rate Derating
Input Setup/Hold Slew Rate
∆tIS
∆tIH
(V/ns)
(ps)
(ps)
0.5
0
0
0.4
+50
+50
0.3
+100
+100
This derating table is used to increase tIS/tIH in the case where the input slew rate is below 0.5V/ns. Input setup/hold slew rate
based on the lesser of AC-AC slew rate and DC-DC slew rate.
7. I/O Setup/Hold Slew Rate Derating
I/O Setup/Hold Slew Rate
∆tDS
∆tDH
(V/ns)
(ps)
(ps)
0.5
0
0
0.4
+75
+75
0.3
+150
+150
This derating table is used to increase tDS/tDH in the case where the I/O slew rate is below 0.5V/ns. I/O setup/hold slew rate
based on the lesser of AC-AC slew rate and DC-DC slew rate.
Rev. 2.2 Mar. ’03
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