PHN70308 Datasheet, PDF (9/10 Pages) NXP Semiconductors – N-channel enhancement mode TrenchMOS transistor array

Philips Semiconductors
N-channel enhancement mode
TrenchMOS transistor array
MECHANICAL DATA
SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm
Product specification
PHN70308
SOT341-1
D
y
Z
28
pin 1 index
1
e
c
15
E
A
X
HE
vM A
14
wM
bp
A2
A1
Q
(A 3)
A
θ
Lp
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D⁽¹⁾ E⁽¹⁾
e
HE
L
Lp
Q
v
w
y
Z ⁽¹⁾
θ
mm
2.0
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
10.4
10.0
5.4
5.2
0.65
7.9
7.6
1.25
1.03
0.63
0.9
0.7
0.2 0.13 0.1
1.1
0.7
8^o
0^o
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
EIAJ
SOT341-1
MO-150AH
EUROPEAN
PROJECTION
ISSUE DATE
93-09-08
95-02-04
Fig.24. SOT341-1 (SSOP28) surface mounting package.
Notes
1. This product is supplied in anti-static packaging. The leads must be protected against static discharge during
transport or handling.
2. Refer to Integrated Circuit Packages, Data Handbook IC26.
3. Epoxy meets UL94 V0 at 1/8".
May 1999
9
Rev 1.000