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PSMN008-75P Datasheet, PDF (5/14 Pages) NXP Semiconductors – N-channel enhancement mode field-effect transistor | |||
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Philips Semiconductors
PSMN008-75P; PSMN008-75B
N-channel enhancement mode ï¬eld-effect transistor
8. Characteristics
Table 5: Characteristics
Tj = 25 °C unless otherwise speciï¬ed
Symbol Parameter
Conditions
Min
Static characteristics
V(BR)DSS drain-source breakdown
ID = 250 µA; VGS = 0 V
75
voltage
VGS(th)
gate-source threshold voltage ID = 1 mA; VDS = VGS;
Figure 10
Tj = 25 °C
2
Tj = 175 °C
1
IDSS
drain-source leakage current VGS = 0 V; VDS = 75 V
Tj = 25 °C
â
Tj = 175 °C
â
IGSS
gate-source leakage current VDS = 0 V; VGS = ±20 V
â
RDSon
drain-source on-state
resistance
VGS = 10 V; ID = 25 A;
Figure 8 and 9
Tj = 25 oC
â
Tj = 175 °C
â
Dynamic characteristics
Qg(tot)
total gate charge
ID = 75 A; VDS = 60 V;
â
Qgs
gate-source charge
VGS = 10 V; Figure 15
â
Qgd
gate-drain (Miller) charge
â
Ciss
input capacitance
VGS = 0 V; VDS = 25 V;
â
Coss
output capacitance
f = 1 MHz; Figure 13
â
Crss
reverse transfer capacitance
â
td(on)
tr
turn-on delay time
turn-off rise time
VDD = 37.5 V; RD = 1.5 â¦;
â
VGS = 10 V; RG = 10 â¦
â
td(off)
turn-off delay time
â
tf
turn-off fall time
â
Source-drain diode
VSD
source-drain (diode forward) IS = 25 A; VGS = 0 V;
â
voltage
Figure 14
trr
reverse recovery time
IS = 5 A; dIS/dt = â100 A/µs;
â
Qr
recovered charge
VGS = 0 V; VR = 30 V
â
Typ
Max
Unit
90
â
V
3
4
V
â
â
V
0.05
10
µA
â
500
µA
4
100
nA
7.9
8.5
mâ¦
â
20
mâ¦
115
â
nC
21
â
nC
50
â
nC
4.7
â
nF
760
â
pF
400
â
pF
18
â
ns
80
â
ns
170
â
ns
100
â
ns
0.8
1.2
V
80
â
ns
227
â
nC
9397 750 07495
Product speciï¬cation
Rev. 01 â 18 September 2000
© Philips Electronics N.V. 2000. All rights reserved.
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