TDA8594_15 Datasheet, PDF (45/49 Pages) NXP Semiconductors – I2C-bus controlled 4  50 W power amplifier

NXP Semiconductors
16. Mounting
TDA8594
I²C-bus controlled 4  50 W power amplifier
2
1
27
26
hole diameter min. 0.92
∅ 0.08 M
1
2.54
2
Dimensions in mm sot878-1_fr
Dimensions in mm.
Reflow soldering is the recommended soldering method.
Dimension ‘1’ relates to dimension ‘e₁’ in Figure 38; dimension ‘2’ relates to dimension ‘e₂’ in
Figure 38.
Fig 39. SOT878-1 reflow soldering footprint
17. Abbreviations
Table 18. Abbreviations
Acronym
Description
ACK
ACKnowledge not
BCDMOS
Bipolar CMOS/DMOS
BTL
Bridge Tied Load
CMOS
Complementary Metal-Oxide Semiconductor
DMOS
Double-diffused Metal-Oxide Semiconductor
DSP
Digital Signal Processor
EMC
ElectroMagnetic Compatibility
ESR
Equivalent Series Resistance
LSB
Least Significant Bit
MSB
Most Significant Bit
NMOS
Negative-channel Metal-Oxide Semiconductor
PMOS
Positive-channel Metal-Oxide Semiconductor
PCB
Printed-Circuit Board
POR
Power-On Reset
SOAR
Safe Operating ARea
SOI
Silicon On Insulator
TDA8594
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 11 June 2013
© NXP B.V. 2013. All rights reserved.
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