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| TDA8594_15 Datasheet, PDF (43/49 Pages) NXP Semiconductors – I2C-bus controlled 4 50 W power amplifier | |||
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NXP Semiconductors
TDA8594
I2C-bus controlled 4 ï´ 50 W power amplifier
15. Package outline
DBS27P: plastic DIL-bent-SIL (special bent) power package; 27 leads (lead length 6.8 mm)
SOT827-1
non-concave
x
Dh
D
Eh
d
j
1
27
Z
e1
w
bp
e
view B: mounting base side
A2
B
EA
L4
L3
L
L2
Q
c
v
e2
m
0
10
scale
Dimensions (mm are the original dimensions)
Unit
A A2 bp c D(1) d Dh E(1) e e1 e2
max
4.6 0.60 0.5 29.2 24.8
15.9
mm nom 19
12
214
min
4.4 0.45 0.3 28.8 24.4
15.5
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
Outline
version
References
IEC
JEDEC
JEITA
SOT827-1
20 mm
Eh j
L L2 L3 L4 m
3.55
3.9 1.15 22.9
8 3.40 6.8
4
3.25
3.1 0.85 22.1
European
projection
x Z(1)
1.8
0.03
1.2
Qvw
2.1
0.6 0.25
1.8
sot827-1_po
Issue date
13-02-13
13-05-30
Fig 37. Package outline SOT827-1 (DBS27P)
TDA8594
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 â 11 June 2013
© NXP B.V. 2013. All rights reserved.
43 of 49
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