TDA8594_15 Datasheet, PDF (44/49 Pages) NXP Semiconductors – I2C-bus controlled 4  50 W power amplifier

NXP Semiconductors
TDA8594
I²C-bus controlled 4  50 W power amplifier
RDBS27P: plastic rectangular-DIL-bent-SIL (reverse bent) power package; 27 leads (row spacing 2.54 mm)
SOT878-1
non-concave
x
D_h
D
E_h
d
j
1
27
Z
e₁
e
w
b_p
view B: mounting base side
A₂
B
E
A
L
c _e2
Q
v
L₁
Dimensions (mm are the original dimensions)
0
10
20 mm
scale
Unit
A A₂ b_p
c D⁽¹⁾ d D_h E⁽¹⁾ e
e₁ e₂ E_h
j
L
L₁ Q
v
w
x Z⁽¹⁾
max
4.6 0.60 0.5 29.2 24.8
15.9
mm nom 13.5
12
2
min
4.4 0.45 0.3 28.8 24.4
15.5
3.55 3.75 3.75 2.1
1.8
1 2.54 8 3.40
0.6 0.25 0.03
3.25 3.15 3.15 1.8
1.2
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
sot878-1_po
Outline
version
References
IEC
JEDEC
JEITA
SOT878-1
European
projection
Issue date
12-12-19
13-02-13
Fig 38. Package outline SOT878-1 (RDBS27P)
TDA8594
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 11 June 2013
© NXP B.V. 2013. All rights reserved.
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