TDA8512J Datasheet, PDF (2/24 Pages) NXP Semiconductors – 26 W BTL and 2 x 13 W SE or 4 x 13 W SE power amplifier

Philips Semiconductors
26 W BTL and 2 × 13 W SE or
4 × 13 W SE power amplifier
CONTENTS
1
FEATURES
2
APPLICATIONS
3
GENERAL DESCRIPTION
4
QUICK REFERENCE DATA
5
ORDERING INFORMATION
6
BLOCK DIAGRAM
7
PINNING
8
FUNCTIONAL DESCRIPTION
8.1
Mode select switch
8.2
Mode select
8.3
Built-in protection circuits
8.4
Short-circuit protection
9
LIMITING VALUES
10
HANDLING
11
THERMAL CHARACTERISTICS
12
DC CHARACTERISTICS
13
AC CHARACTERISTICS
14
APPLICATION INFORMATION
14.1
Input configuration
14.2
Output power
14.3
Power dissipation
14.4
Supply Voltage Ripple Rejection (SVRR)
14.5
Switch-on and switch-off
14.6
PCB layout and grounding
14.7
Typical performance characteristics
Preliminary specification
TDA8512J
15
PACKAGE OUTLINE
16
SOLDERING
16.1
Introduction to soldering through-hole mount
packages
16.2
Soldering by dipping or by solder wave
16.3
Manual soldering
16.4
Suitability of through-hole mount IC packages
for dipping and wave soldering methods
17
DATA SHEET STATUS
18
DEFINITIONS
19
DISCLAIMERS
2001 Nov 16
2