SAA7715 Datasheet, PDF (2/36 Pages) NXP Semiconductors – Digital Signal Processor

Philips Semiconductors
Digital Signal Processor
Preliminary specification
SAA7715H
CONTENTS
1
1.1
1.2
2
3
4
5
6
7
8
8.1
8.2
8.3
8.3.1
8.3.2
8.3.3
8.3.4
8.3.5
8.3.6
8.4
8.5
8.5.1
8.5.2
8.6
8.7
8.8
8.9
8.10
9
9.1
9.2
9.3
9.4
9.5
9.6
9.7
9.8
9.9
FEATURES
Hardware
Possible firmware
APPLICATIONS
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
PLL division factors for different clock inputs
The word select PLL
The Filter Stream DAC (FSDAC)
Interpolation filter
Noise shaper
Function of pin POM
Power off plop suppression
Pin VREFDA for internal reference
Supply of the analog outputs
External control pins
Digital serial inputs/outputs and SPDIF inputs
Digital serial inputs/outputs
SPDIF inputs
I²C-bus interface (pins SCL and SDA)
Reset
Power-down mode
Power supply connection and EMC
Test mode connections (pins TSCAN, RTCB
and SHTCB)
I²C-BUS PROTOCOL
Addressing
Slave address (pin A0)
Write cycles
Read cycles
Program RAM
Data word alignment
I²C-bus memory map specification
I²C-bus memory map definition
Table definitions
10
10.1
10.1.1
10.2
10.2.1
10.3
10.3.1
10.3.2
10.3.3
10.3.4
10.3.5
10.3.6
10.3.7
10.4
10.4.1
10.4.2
10.4.3
10.4.4
11
12
13
14
15
16
17
18
18.1
18.2
18.3
18.4
18.5
19
20
21
22
SOFTWARE IN ROM DESCRIPTION
Audio dynamics compressor
Theory of operation
Audio enhancer
Theory of operation
Equalizer
General description
Overview
Controls
Centre frequency
Gain
Q
Hints and tips
Stereo spatializer
Overview
Controls
Mix
Hints and tips
LIMITING VALUES
THERMAL CHARACTERISTICS
CHARACTERISTICS
I²S-BUS TIMING
I²C-BUS TIMING
APPLICATION DIAGRAM
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I²C COMPONENTS
2001 May 07
2