TDA8376 Datasheet, PDF (17/44 Pages) NXP Semiconductors – I2C-bus controlled PAL/NTSC TV processors

Philips Semiconductors
I²C-bus controlled PAL/NTSC TV processors
Objective specification
TDA8376; TDA8376A
9 LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
V_P
T_stg
T_amb
T_sol
T_j
V_es
supply voltage
storage temperature
operating ambient temperature
soldering temperature
operating junction temperature
electrostatic handling
for 5 s
all pins; notes 1 and 2
all pins; notes 1 and 3
Notes
1. All pins are protected against ESD by means of internal clamping diodes.
2. Human Body Model (HBM): R = 1.5 kΩ; C = 100 pF.
3. Machine Model (MM): R = 0 Ω; C = 200 pF.
MIN.
−
−25
0
−
−
−2 000
−200
MAX.
9.0
+150
70
260
150
+2 000
+200
UNIT
V
°C
°C
°C
°C
V
V
10 THERMAL CHARACTERISTICS
SYMBOL
R_{th j-a}
PARAMETER
thermal resistance from junction to ambient in free air
SDIP52
QFP64
VALUE
40
50
UNIT
K/W
K/W
11 QUALITY SPECIFICATION
In accordance with “SNW-FQ-611E”. The number of the quality specification can be found in the “Quality Reference
Handbook”. The handbook can be ordered using the code 9398 510 63011.
11.1 Latch-up
At T_amb = 70 °C all pins meet the following specification.
• I_trigger ≥ 100 mA or ≥1.5V_DD(max)
• I_trigger ≤ −100 mA or ≤−0.5V_DD(max).
1996 Jan 26
17