TDA4857PS Datasheet, PDF (13/56 Pages) NXP Semiconductors – I2C-bus autosync deflection controller for PC monitors

Philips Semiconductors
I²C-bus autosync deflection controller for
PC monitors
Product specification
TDA4857PS
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); all voltages measured with respect to ground.
SYMBOL
V_CC
V_i(n)
V_o(n)
V_I/O(n)
I_o(HDRV)
I_i(HFLB)
I_o(CLBL)
I_o(BOP)
I_o(BDRV)
I_o(EWDRV)
I_o(FOCUS)
T_amb
T_j
T_stg
V_ESD
PARAMETER
CONDITIONS
supply voltage
input voltage for pins:
BIN
HSYNC, VSYNC, VREF, HREF, VSMOD and HSMOD
SDA and SCL
XRAY
output voltage for pins:
VOUT2, VOUT1 and HUNLOCK
BDRV and HDRV
input/output voltages at pins BOP and BSENS
horizontal driver output current
horizontal flyback input current
video clamping pulse/vertical blanking output current
B+ control OTA output current
B+ control driver output current
EW driver output current
focus driver output current
ambient temperature
junction temperature
storage temperature
electrostatic discharge for all pins
note 1
note 2
MIN.
−0.5
−0.5
−0.5
−0.5
−0.5
−0.5
−0.5
−0.5
−
−10
−
−
−
−
−
−20
−
−55
−150
−2 000
MAX.
+16
+6.0
+6.5
+8.0
+8.0
+6.5
+16
+6.0
100
+10
−10
1
50
−5
−5
+70
150
+150
+150
+2 000
UNIT
V
V
V
V
V
V
V
V
mA
mA
mA
mA
mA
mA
mA
°C
°C
°C
V
V
Notes
1. Machine model: 200 pF; 0.75 µH; 10 Ω.
2. Human body model: 100 pF; 7.5 µH; 1500 Ω.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
R_th(j-a)
thermal resistance from junction to ambient
CONDITIONS
in free air
VALUE
55
UNIT
K/W
QUALITY SPECIFICATION
In accordance with “URF-4-2-59/601”; EMC emission/immunity test in accordance with “DIS 1000 4.6” (IEC 801.6).
SYMBOL
V_EMC
emission test
immunity test
PARAMETER
CONDITIONS
note 1
note 1
MIN.
−
−
TYP.
1.5
2.0
MAX. UNIT
−
mV
−
V
Note
1. Tests are performed with application reference board. Tests with other boards will have different results.
2000 Jan 31
13